The STMicroelectronics VN1160TR-E is a high-voltage, high-speed N-channel power MOSFET designed for automotive and industrial applications, particularly in motor drive, power conversion, and switching systems. This device integrates a robust MOSFET structure capable of handling high currents and voltages while maintaining low on-resistance, fast switching performance, and thermal reliability. The VN1160TR-E is optimized for high-efficiency operation in switching applications where both conduction and switching losses must be minimized, making it suitable for half-bridge configurations in DC-DC converters, motor drivers, and other power management circuits.
The VN1160TR-E belongs to ST’s TrenchFET Power MOSFET family, which utilizes a vertical trench-gate structure to reduce conduction losses and improve switching speed. It features a low gate charge for reduced drive requirements, fast switching transitions, and enhanced avalanche and short-circuit capability. The device is provided in a compact DPAK surface-mount package suitable for automated assembly and efficient PCB thermal management. Its design balances high-current carrying capacity, low gate drive energy, and robust ruggedness to support harsh automotive and industrial environments.
## Absolute Maximum Ratings
The absolute maximum ratings define the safe stress limits beyond which permanent damage may occur:
* Drain-Source Voltage (V_DSS): 60 V
* Continuous Drain Current (I_D) at T_C = 25°C: 75 A
* Pulsed Drain Current (I_DM): 300 A
* Maximum Power Dissipation (P_D) at T_C = 25°C: 150 W
* Gate-Source Voltage (V_GS): ±20 V
* Maximum Junction Temperature (T_j): 150°C
* Storage Temperature (T_stg): –55°C to 150°C
* Avalanche Energy Capability (Single Pulse E_AS): 2.5 mJ
These parameters indicate the VN1160TR-E can operate under high-current, high-voltage pulses while requiring attention to thermal dissipation and PCB layout.
## Recommended Operating Conditions
The VN1160TR-E should be operated within the recommended ranges for safe and reliable performance:
* Gate-Source Voltage (V_GS) for full enhancement: 10 V typical
* Continuous Drain Current (I_D): up to 75 A at T_C = 25°C with appropriate heatsinking
* Junction Temperature (T_j): –55°C to 150°C
* Ambient Temperature (T_a): –40°C to 125°C
* Switching Frequency: up to several hundred kHz, depending on gate drive and thermal conditions
Proper operation within these conditions ensures low R_DS(on), minimal thermal stress, and stable switching characteristics.
## Electrical Characteristics
Electrical characteristics are measured at standard conditions, typically V_DS = 10 V, I_D = 1 A, and T_C = 25°C unless otherwise specified:
* Drain-Source On-Resistance (R_DS(on)) at V_GS = 10 V: 1.7 mΩ typical, 2.0 mΩ maximum
* Gate Threshold Voltage (V_GS(th)): 1.0–2.5 V
* Input Capacitance (C_iss): 3,500 pF typical
* Gate Charge (Q_g): 80 nC typical at V_DS = 50 V
* Turn-On Delay Time (t_d(on)): 20 ns typical
* Rise Time (t_r): 25 ns typical
* Turn-Off Delay Time (t_d(off)): 35 ns typical
* Fall Time (t_f): 30 ns typical
* Drain-Source Leakage Current (I_DSS) at V_DS = 60 V, V_GS = 0 V: 5 μA typical
These characteristics indicate extremely low conduction losses due to minimal R_DS(on) and efficient switching enabled by low gate charge and fast transition times.
## Switching and Dynamic Performance
The VN1160TR-E is optimized for high-speed switching applications:
* Total Gate Charge (Q_g): Low gate charge reduces gate drive energy, improving efficiency in high-frequency applications
* Reverse Transfer Capacitance (C_rss): 80 pF typical, minimizing Miller effect during switching transitions
* Fast Switching: t_on + t_off < 100 ns typical, supporting high-frequency PWM or motor control signals
* Short-Circuit Withstand: Capable of withstanding short-circuit events of up to 5 μs with T_j < 150°C
* Avalanche Robustness: Designed to absorb repetitive energy pulses without degradation, enhancing reliability in inductive load applications
This dynamic performance makes the VN1160TR-E ideal for automotive half-bridge inverters, synchronous rectifiers, and fast-switching DC-DC converters.
## Thermal Characteristics
Thermal management is crucial for sustaining high-current operation:
* Thermal Resistance Junction-to-Case (R_θJC): 0.6°C/W typical
* Thermal Resistance Junction-to-Ambient (R_θJA): 40°C/W typical on PCB with 1 in² of copper area
* Maximum Junction Temperature: 150°C, with thermal shutdown recommended in system design
* Power Dissipation Capability: 150 W at T_C = 25°C, derated linearly to 0 W at T_C = 150°C
* Package Considerations: The DPAK package supports surface mounting with copper pads for efficient heat spreading
Effective PCB layout with sufficient copper area and thermal vias ensures junction temperature remains within safe limits during high-current pulses.
## Package Information
The VN1160TR-E is supplied in a DPAK surface-mount package:
* Package Type: DPAK (TO-252)
* Lead Finish: Tin-plated leads for reliable soldering
* Mounting: SMT suitable for automated PCB assembly
* Thermal Efficiency: Designed for optimal heat dissipation via PCB copper and package tab
This package allows compact PCB design while maintaining high-current handling capabilities.
## Protection and Reliability Features
The VN1160TR-E includes features for robustness in automotive and industrial environments:
* Short-Circuit Capability: Survives brief high-current events without device failure
* Avalanche Energy Capability: Can handle repetitive energy pulses in inductive circuits
* ESD Immunity: Enhanced robustness to electrostatic discharge events
* High Temperature Operation: Rated for junction temperatures up to 150°C without degradation
* Rugged TrenchFET Structure: Provides immunity to latch-up and ensures high reliability under continuous operation
These features make the VN1160TR-E suitable for harsh operating conditions and long-term reliability.
## Typical Applications
This MOSFET is ideal for a variety of high-power, high-speed applications:
* Automotive DC-DC converters and power distribution modules
* Motor drivers and automotive half-bridge or full-bridge inverters
* Synchronous rectification in power supply circuits
* High-frequency switching in industrial power control systems
* Battery management and energy storage applications requiring high efficiency
The combination of low on-resistance, fast switching, thermal robustness, and high current handling makes VN1160TR-E a versatile solution for high-efficiency, high-reliability power electronics.